打膠機(jī)使用期間容易出現(xiàn)這樣的問(wèn)題
打膠機(jī)作為一種工業(yè)機(jī)械設(shè)備，它在使用過(guò)程中難免會(huì)因?yàn)槭褂脮r(shí)間過(guò)長(zhǎng)或使用不當(dāng)出現(xiàn)一些故障，
濟(jì)南雙組份打膠機(jī)時(shí)使用期間容易出現(xiàn)這樣的問(wèn)題：
As a kind of industrial mechanical equipment, it is hard to avoid some failures due to long use time or improper use. Jinan two-component gluing machine is prone to the following problems during use:
拉絲、拖尾
Wire drawing and tailing
故障現(xiàn)象：出膠過(guò)程中出現(xiàn)拉絲、拖尾的情況。
Fault phenomenon: wire drawing and tailing occur in the process of glue dispensing.
產(chǎn)生原因：膠嘴內(nèi)徑太小；點(diǎn)膠壓力太高；膠嘴離PCB的間距太大；粘膠劑過(guò)期或品質(zhì)不好；貼片膠黏度太高；膠水取出后未能恢復(fù)到室溫；點(diǎn)膠量太多。
Cause: the inner diameter of rubber nozzle is too small; The dispensing pressure is too high; The distance between the rubber nozzle and the PCB is too large; The adhesive is expired or of poor quality; The stickiness of the patch is too high; The glue failed to recover to room temperature after being taken out; Too much dispensing.
解決辦法：改換內(nèi)徑較大的膠嘴；降低點(diǎn)膠壓力；調(diào)節(jié)“止動(dòng)”高度；換膠；選擇適合黏度的膠種；從冰箱中取出后應(yīng)恢復(fù)到室溫；調(diào)整點(diǎn)膠量。
Solution: replace the rubber nozzle with larger inner diameter; Reduce the dispensing pressure; Adjust the "stop" height; Change glue; Select the glue type with suitable viscosity; After being taken out of the refrigerator, it should be restored to room temperature; Adjust the dispensing amount.
固化后，元器件黏結(jié)強(qiáng)度不夠，波峰焊后會(huì)掉片
After curing, the adhesive strength of components is not enough, and chips will fall off after wave soldering
產(chǎn)生原因：固化后工藝參數(shù)不到位；溫度不夠；元件尺寸過(guò)大；吸熱量大；光固化燈老化；膠水不夠；元件或pcb有污染。
Cause: the process parameters after curing are not in place; Insufficient temperature; The element size is too large; Large heat absorption; Aging of light curing lamp; Insufficient glue; Components or PCB are contaminated.
解決辦法：調(diào)整固化曲線，特別是提高固化溫度，通常熱固化膠的峰值固化溫度很關(guān)鍵，達(dá)到峰值溫度易引起掉片，對(duì)光固化膠來(lái)說(shuō)，應(yīng)仔細(xì)觀察光固化燈是否老化，燈管是否有發(fā)黑現(xiàn)象，膠水的數(shù)量，元件、pcb是否有污染等。
Solution: adjust the curing curve, especially increase the curing temperature. Generally, the peak curing temperature of the thermal curing adhesive is very critical, and it is easy to cause the chip to fall off when the peak temperature is reached. For the photo curing adhesive, carefully observe whether the photo curing lamp is aging, whether the lamp tube is blackened, the amount of glue, and whether the components and PCB are polluted.
空打
Air strike
故障現(xiàn)象：只有點(diǎn)膠動(dòng)作，無(wú)出現(xiàn)膠量。
Fault phenomenon: only dispensing action, no glue amount.
產(chǎn)生原因：混入氣泡；膠嘴堵塞。
Cause: mixed with bubbles; The rubber nozzle is blocked.
解決方法：注射筒中的膠應(yīng)進(jìn)行脫氣泡處理；按膠嘴堵塞方法處理。
Solution: the rubber in the injection cylinder should be deaerated; Handle according to the method of rubber nozzle blockage.
固化后元件引腳上浮、移位
Floating and displacement of component pins after curing
故障現(xiàn)象：固化后元件引腳浮起來(lái)或移位，波峰焊后錫料會(huì)進(jìn)入焊盤(pán)，嚴(yán)重時(shí)會(huì)出現(xiàn)短路和開(kāi)路。
Fault phenomenon: after curing, the component pin floats or shifts. After wave soldering, the solder will enter the pad. In serious cases, short circuit and open circuit will occur.
產(chǎn)生原因：貼片膠不均勻；貼片膠量過(guò)多；貼片時(shí)元件偏移。
Cause: uneven patch adhesive; Excessive amount of patch adhesive; Component offset when mounting.
解決辦法：調(diào)整點(diǎn)膠工藝參數(shù)；控制點(diǎn)膠量；調(diào)整貼片工藝參數(shù)。
Solution: adjust the dispensing process parameters; Control the dispensing amount; Adjust the patch process parameters.
元器件偏移
Component offset
故障現(xiàn)象：固化元器件移位，嚴(yán)重時(shí)元器件引腳不在焊盤(pán)上。
Fault phenomenon: the solidified components are displaced. In serious cases, the component pins are not on the pad.
產(chǎn)生原因：貼片膠出膠量不均勻（例如片式元件兩點(diǎn)膠水一個(gè)多一個(gè)少）；貼片時(shí)元件移位；貼片膠黏力下降；點(diǎn)膠后pcb放置時(shí)間太長(zhǎng)；膠水半固化。
Cause: the glue output of the patch adhesive is not uniform (for example, the two-point glue of the chip component is more than one and less than the other); Element displacement during mounting; The adhesive force of the patch decreases; The PCB is placed too long after dispensing; The glue is half cured.
解決辦法：檢查膠嘴是否有堵塞；排除出膠不均勻現(xiàn)象；調(diào)整貼片機(jī)工作狀態(tài)；換膠水；點(diǎn)膠后ＰＣＢ放置時(shí)間不應(yīng)過(guò)長(zhǎng)。
Solution: check whether the rubber nozzle is blocked; Eliminate the uneven phenomenon of glue discharge; Adjust the working state of the Mounter; Change glue; The PCB shall not be placed for too long after dispensing.
為了避免點(diǎn)膠機(jī)在日常使用過(guò)程中經(jīng)常出現(xiàn)故障，關(guān)鍵是要做好點(diǎn)膠機(jī)的保養(yǎng)，維護(hù)保養(yǎng)點(diǎn)膠機(jī)要注意很多，詳細(xì)內(nèi)容就來(lái)我們網(wǎng)站
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In order to avoid frequent failures in the daily use of the dispenser, the key is to do a good job in the maintenance of the dispenser. Pay attention to the maintenance of the dispenser. Please visit our website for details http://www.cxjrxx.com Let's consult.
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