點膠機在點膠時要注意什么？
在點膠機行業中，出產中容易呈現以下幾個問題，好比膠點巨細不匹配、拉絲、膠水浸染焊盤、固化強度不好易掉片等。解決這些問題應整體研究各項技術工藝參數，從而找到解決問題的法子。
In the dispensing machine industry, the following problems are easy to appear in production, such as mismatch of glue point size, wire drawing, glue-impregnated pad, poor curing strength and easy chip dropping. To solve these problems, we should study the technological parameters as a whole so as to find a way to solve the problem.
那么如何解決點膠機在行業的這些問題呢?具體有以下幾點來解決點膠機呈現的問題.
So how to solve these problems in the dispensing machine industry? There are the following specific points to solve the dispensing machine problems.
1 點膠量的巨細
The size of a dispensing volume
按照工作經驗，膠點直徑的巨細應為焊盤間距的一半，貼片后膠點直徑應為膠點直徑的1.5倍。這樣就可以保證有充沛的膠水來粘結元件又避免過多膠水浸染焊盤。點膠量幾多由螺旋泵的扭轉時間長短來抉擇，實際中應按照出產環境(室溫、膠水的粘性等)選擇泵的扭轉時間。
According to the working experience, the size of the adhesive spot diameter should be half of the distance between the pads, and the diameter of the adhesive spot should be 1.5 times of the adhesive spot diameter after patching. This ensures that there is plenty of glue to bond components and avoids too much glue to impregnate the pad. The amount of dispensing is determined by the torsion time of the screw pump. In practice, the torsion time of the screw pump should be selected according to the production environment (room temperature, glue stickiness, etc.).
2 點膠壓力(背壓)
2 dispensing pressure (back pressure)
今朝所用點膠機采用螺旋泵供給點膠針頭膠管采納一個壓力來保證足夠膠水供給螺旋泵(以CAMALOT5000為例)。背壓壓力太大易造成膠溢出、膠量過多;壓力太小則會呈現點膠斷續現象，漏點，從而造成缺陷。應按照同品質的膠水、工作環境溫度來選擇壓力。環境溫度高則會使膠水粘度變小、流動性變好，這時需調低背壓就可保證膠水的供給，反之亦然。
At present, the dispensing machine uses a screw pump to supply the dispensing needle hose to adopt a pressure to ensure that enough glue is supplied to the screw pump (CAMALOT5000 as an example). Back pressure pressure is too high to cause glue overflow and excessive glue volume; too low pressure will present the phenomenon of intermittent dispensing, leakage point, thus causing defects. Pressure should be selected according to the same quality glue and working environment temperature. High ambient temperature will make the glue viscosity smaller and fluidity better. At this time, it is necessary to reduce back pressure to ensure the glue supply, and vice versa.
3 針頭巨細
3 needle size
在工作實際中，針頭內徑巨細應為點膠膠點直徑的1/2，點膠過程中，應按照PCB上焊盤巨細來拔取點膠針頭：如0805和1206的焊盤巨細相差不大，可以拔取同一種針頭，可是對于相差懸殊的焊盤就要拔取不合針頭，這樣既可以保證膠點質量，又可以提橫跨產效率。
In practice, the inner diameter of the needle should be 1/2 of the diameter of the spot. In the process of dispensing, the needle should be pulled out according to the size of the pad on PCB. If the pad size of 0805 and 1206 is not different, the same needle can be pulled out, but for the pad with great difference, the needle should be pulled out, which can not only ensure the quality of the spot, but also improve the cross-production efficiency.
4 針頭與PCB板間的距離
Distance between 4 needles and PCB board
不合的點膠機采用不合的針頭，有些針頭有必然的止動度(如CAM/A LOT 5000)。每次工作開始應做針頭與PCB距離的校準，即Z軸高度校準。
Non-conforming dispensing machines use non-conforming needles, and some needles have a certain degree of locomotion (such as CAM/A LOT 5000). The distance between needle and PCB should be calibrated at the beginning of each work, that is, Z axis height calibration.
5 膠水溫度
5 glue temperature
一般環氧樹脂膠水應保留在0--5℃的冰箱中，操作時應提前1/2小時拿出，使膠水充實與工作溫度相合適。膠水的操作溫度應為23℃--25℃;環境溫度對膠水的粘度影響很大，溫渡過低則會膠點變小，呈現拉絲現象。環境溫度相差5℃，會造成50%點膠量變化。因而對于環境溫度應加以節制。同時環境的溫度也應該給以保證，濕度小膠點易變干，影響粘結力。
Generally, the epoxy resin glue should be kept in the refrigerator at 0 - 5 C, and should be taken out 1/2 hours in advance in order to make the glue full and suitable for the working temperature. The operating temperature of the glue should be 23 - 25 C. The ambient temperature has a great influence on the viscosity of the glue. If the temperature is too low, the glue point will become smaller, showing the phenomenon of wire drawing. The difference of ambient temperature is 5 C, which will cause 50% change of dispensing amount. Therefore, environmental temperature should be controlled. At the same time, the temperature of the environment should also be guaranteed. The adhesive point with small humidity is easy to dry, which affects the bonding force.
6 膠水的粘度
Viscosity of 6 glue
膠的粘度直接影響點膠的質量。粘度大，則膠點會變小，甚拉絲;粘度小，膠點會變大，進而可能滲染焊盤。點膠過程中，應對不合粘度的膠水，拔取合理的背壓和點膠速度。
Viscosity of glue directly affects the quality of dispensing. If the viscosity is high, the adhesive point will become smaller, even wire drawing; if the viscosity is low, the adhesive point will become larger, and then the pad may be stained. In the process of dispensing, the glue that is not viscous should be pulled out with reasonable back pressure and dispensing speed.
7 固化溫度曲線
7 Curing Temperature Curve
對于膠水的固化，一般出產廠家已給出溫度曲線。在實際應盡可能采用較高溫度來固化，使膠水固化后有足夠強度。
For the curing of glue, the temperature curve has been given by the manufacturer. In practice, higher temperature should be used as far as possible to make the glue strong enough after curing.
The above content is organized and published by Jinan two-component glue punch. More related content can be consulted by clicking on our official website: http://www.cxjrxx.com.
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